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Semiconductor Equipment

Wet Cleaning System

The C&C Division supplies cleaning systems embedded with various processes to remove the contaminants on both sides of the 300 m silicon wafer in order to prevent losing the yield and reliability of semiconductor products due to the fine particles, metal impurities, and four chemical materials that attach to the surface during the manufacture process.

Batch Cleaning System

CMP 장비

300mm "Wezen BF" (Front Type)

CMP 장비

300mm "Wezen BS" (Ⅰ Type)

The precipitating cleaning system precipitates 25-50 sheets of wafer in multiple cleaning tubs to treat with each chemical solution, cleanse with pure water, and dry with hot IPA. KCTech’s batch cleaning system is classified into Front Type and I Type according to the wafer flow and easily adjusts to the space layout of the processing line.

Particle Performance

· SC1 Last Clean : ≤ 10ea, HF Last Clean : ≤ 30ea
· Rinse only : ≤ 10ea, FRD : ≤ 30ea

Dryer Performance

· Water Mark Free (@IPA Bubble with Hot Function)

Etch Rate Uniformity

· With in Wafer/Wafer to Wafer : ≤ 3%
(Using Thermal Oxide Wafer)

Throughput

· Chemical + RD : > 450wfs/hr(@Front Type)
· CHemical + FRD : > 350wfs/hr(@3FRD)

Metallic Contamination

· K, Ca, Cr, Fe, Zn, Mn, Ni, Cu : < 0.5E10 atoms/cm2

K-3000 Single Spin Processor

CMP 장비

K-3000

For precise control of each sheet of wafer, eight to 12 individual chambers are used for chemical treatment, rinsing, and drying. It is easy to reduce the cycle time, enhance the consistency of wet etching, and change and add the chemical and cleansing sequence. The process is highly adjustable and allows continual processing without any delay after cleaning/drying while preventing contamination and growth of natural oxidation film.

Application

· Polymer Removal, Film Etch, Pre Clean
· FOM, BOE, HF, 03+Nano Spray, DSP, SC-1, IPA/N2 Dry

Specifications

· 4 FOUP In/Out Port
· 12 Chamber, 2 Buffer Station, 2 Layer (Linear Moving WTR)
· Index Robot : Multi Blade (4+1), WTR : Dual Blade
· An Independent Chamber : 1Ch 1PC, 4Aixs nozzle

Features

· Compact Design for Footprint
· Throughput Maximizing Mechanism 460 WPH
· @19m Particle Removal Performance

Equipment Sales Team : equipsales@kctech.co.kr